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EMBEST
TECHNOLOGY
0755-33190868
globalsales@embest-tech.com
Nanshan District, Shenzhen City Park Avenue, Lane 1183, Nanshan Valley Valley Innovation Industrial Park, 4th Floor, Building B

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Time: 3~15days
weight: 1.1 kg

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Overview:


 

General This is the expansion bus interface of the MBM-SAM-9G base board to connect a certain CPU Module.They form an excellent evaluation plaftform and led out most signals of ATMEL ARM-based MCUs & eMPUs to enable developer implement various application evaluation, and plenty general communication interface such as UART, Ethernet, LCD, Touch Screen, USB Host, USB Device, ADC, DAC, SPI, SDIO, GPIOs and so on.



Features:



  • Insulation material: Liquid crystal polymer.

  • Contact material: Phosphor bronze.

  • SMT lead coplanarity: .004"(0.10mm) max (30-60), .006"(0.15mm) (90-150).

  • Impedance: 50Ohm average.

  • Crosstalk: -19.2 @ 500 MHz.

  • Mating height with QTH: .197 (5.00).

  • Maximum processing temperature: 230 Degree for 60 seconds.


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