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Nanshan District, Shenzhen City Park Avenue, Lane 1183, Nanshan Valley Valley Innovation Industrial Park, 4th Floor, Building B

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Manufacturer: NXP
Kernel: ARM Cortex-M3
Time: 1 weeks
weight: 0.45 kg

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Product features:

  • Based on 32-bitARMCortex-M4/M0 Dual Core MicrocontrollerLPC4357FET256,running at frequencies of up to 204MHz

  • CPU Internal 1024Kbytes of Flash, 136 Kbytes of SRAM and 16 Kbytes of EEPROM

  • On board 128MB Nand Flash、32MB SDRAM,4MB SPI Flash(reserved)、2Kb EEPROM

  • 4.3inch (Resolution: 480x272) TFT LCD touch screen

  • Follow EMC、FCC、3C design standard,performance and index meet related standards

  • Fruitful expansion communication interfaces:

    • 3 x 3 line serial port ,RS232 voltage

    • One USB2.0 HS Deriver port ,one USB2.0 FS Host port

    • One Micro SD card interface

    • One 10/100Mbps Ethernet port

    • One RS485 port,one CAN 2.0B ports,one SPI bus

  • Two input and two output I/O interfaces implemented with isolated by optocouplers

  • Support FatFs_vR0.08a file system(for SD card)

  • Support uC/OS-II_v2.91 OS & emWin5.18 graphical interfaces

  • Support LwIP_v1.4.0 protocol stack

  • Support SPI to serial port module( up to 4 serial ports)

  • Support 1.3 mega pixel OV9655 Camera module(SGPIO interface)



  • NXP LPC4357FET256/LPC1857FET256

  • Integrating hardware a floating-point unit

  • Integrating a 1024KB Flash, a136 KB SRAM and a 16KB EEPROM

  • Integrating a LCD controller with support of 24bpp true-color mode and a resolution of up to 1024×768

  • An USB 2.0 high-speed Host/Device/OTG interface with on-chip PHY and support of DMA transmission

  • An USB 2.0 high-speed Host/Device interface with on-chip PHY and ULPI which support external high-speed PHY

  • A 10/100 Mbits Ethernet MAC MII/RMII interface

  • A four-wire SPI flash interface (SPIFI) with data transfer rate of up to 40Mbps per channel

  • Two CAN 2.0B, four UART, two I2S, two I2C, two SSP, one SPI buses

  • Four 32-bit general purpose timer, two standard PWM, one motor control PWM with Quadrature encoder interface

  • 400KHz two 10-bit ADCs operating at up to 400KHz, one 10-bit DAC operating at up to 400KHz

  • Serial GPIO interface (SGPIO)

  • 164 general-purpose I/O interfaces

  • Two watchdog timers

On-Board Memories:

  • 128MB NandFlash

  • 32MB SDRAM

  • 2Kb EEPROM

  • 4Mb SPI Flash (spare solder pads)

Communication Interface:

  • Three serial interface implemented with phoenix connectors

    • oUART0: 3-wire serial interface, RS232 level

    • oUART2: 3-wire serial interface, RS232 level

    • oUART3: 3-wire serial interface, RS232 level

  • One RS485 interface implemented with phoenix connectors

  • one CAN2.0B interfaces implemented with phoenix connectors

  • Two USB interfaces

    • oUSB2.0 Device×1, High-speed, 480Mbps

    • oUSB2.0 Host×1, Full-speed, 12Mbps

  • One 10/100Mbps Ethernet interface

  • One TF card slot

  • One 20-pin standard JTAG debug interface

  • Two input and two output I/O interfaces implemented with phoenix connectors and isolated by optocouplers

  • One SPIFI interface

  • One high-precision RTC (no battery by default)

  • Spare interface for external hardware watchdog


  • 4.3-inch (480x272) TFT LCD, 16bit RGB565 mode, supporting 4-wire resistive touch-screen

  • One ISP button

  • One buzzer

  • Electrical Features

  • Operating Temperature: 0 ℃ ~ 70 ℃

  • Storage Temperature: -40 ℃ ~ 85 ℃

  • Operating Humidity: 0% ~ 90% (Non-condensing)

  • Power Supply: DC 9~24V, 150~400mA@12V

  • Electrical Standards: CE, FCC and CCC

  • PCB Layers: 4-layer PCB

On-Board Interfaces:


On-board interfaces

System Block Diagram:


System block diagram

Table 1 Legend of Block Diagram

EDM1043BR-01 Interface modules of CPU
EDM1043BR-01 Chips or spare solder pads on the board
EDM1043BR-01 Interfaces on the board

Hardware Dimensions (mm):


Hardware dimensions

System Features:

  • Supporting uC/OS-II_v2.91 operating system

  • Supporting emWin5.18 graphic interface

  • Supporting FatFs_vR0.08afilesystem

  • Supporting LWIP _v1.4.0 protocol stack

Development Environments:

  • IAR EWARM Integrated Development Environment

    • oAll the drivers can work with IAR EWARM V6.40 or higher;

  • Keil MDK-ARM Integrated Development Environment

    • All the drivers and applications can work with Keil MDK-ARM V4.60 or higher.

Debugging Tools:

  • ULINK2

    • ULINK2 is recommended to be used under Keil MDK-ARM for best debugging performance;

  • JLINK-V9.1

    • JLINK-V9.1 is recommended to be used under IAR EWARM for best debugging performance

Drivers and Example Applications:

  • Basic peripheral driver examples;

  • BSP example applications based on uC/OS-II_v2.91 real-time operating system

  • BSP example applications based on emWin5.18 (GUI)

  • Example applications of OV9655 Camera implemented through SGPIO

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