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Nanshan District, Shenzhen City Park Avenue, Lane 1183, Nanshan Valley Valley Innovation Industrial Park, 4th Floor, Building B

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Manufacturer: NXP
Kernel: ARM Cortex-M3
Time: 1 weeks
weight: 0.04 kg

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Product features:

  • Based on 32-bitARMCortex-M4/M0 Dual Core MicrocontrollerLPC4357FET256,running at frequencies of up to 204MHz

  • CPU Internal 1024Kbytes of Flash, 136 Kbytes of SRAM and 16 Kbytes of EEPROM

  • On board 128MB Nand Flash、32MB SDRAM,4MB SPI Flash(reserved)、2Kb EEPROM

  • 4.3inch (Resolution: 480x272) TFT LCD touch screen

  • Follow EMC、FCC、3C design standard,performance and index meet related standards

  • Fruitful expansion communication interfaces:

    • 3 x 3 line serial port ,RS232 voltage

    • One USB2.0 HS Deriver port ,one USB2.0 FS Host port

    • One Micro SD card interface

    • One 10/100Mbps Ethernet port

    • One RS485 port,one CAN 2.0B ports,one SPI bus

  • Two input and two output I/O interfaces implemented with isolated by optocouplers

  • Support FatFs_vR0.08a file system(for SD card)

  • Support uC/OS-II_v2.91 OS & emWin5.18 graphical interfaces

  • Support LwIP_v1.4.0 protocol stack

  • Support SPI to serial port module( up to 4 serial ports)

  • Support 1.3 mega pixel OV9655 Camera module(SGPIO interface)



  • NXP LPC4357FET256/LPC1857FET256

  • Integrating hardware a floating-point unit

  • Integrating a 1024KB Flash, a136 KB SRAM and a 16KB EEPROM

  • Integrating a LCD controller with support of 24bpp true-color mode and a resolution of up to 1024×768

  • An USB 2.0 high-speed Host/Device/OTG interface with on-chip PHY and support of DMA transmission

  • An USB 2.0 high-speed Host/Device interface with on-chip PHY and ULPI which support external high-speed PHY

  • A 10/100 Mbits Ethernet MAC MII/RMII interface

  • A four-wire SPI flash interface (SPIFI) with data transfer rate of up to 40Mbps per channel

  • Two CAN 2.0B, four UART, two I2S, two I2C, two SSP, one SPI buses

  • Four 32-bit general purpose timer, two standard PWM, one motor control PWM with Quadrature encoder interface

  • 400KHz的Two 10-bit ADCs operating at up to 400KHz, one 10-bit DAC operating at up to 400KHz

  • Serial GPIO interface (SGPIO)

  • 164 general-purpose I/O interfaces

  • Two watchdog timers

On-Board Memories:

  • 128MB NandFlash

  • 32MB SDRAM

  • 2Kb EEPROM

  • 4Mb SPI Flash (spare solder pads)

Communication Interface:

  • Three serial interface implemented with phoenix connectors

    • UART0: 3-wire serial interface, RS232 level

    • UART2: 3-wire serial interface, RS232 level

    • UART3: 3-wire serial interface, RS232 level

  • One RS485 interface implemented with phoenix connectors

  • one CAN2.0B interfaces implemented with phoenix connectors

  • Two USB interfaces

    • USB2.0 Device×1, High-speed, 480Mbps

    • USB2.0 Host×1, Full-speed, 12Mbps

  • One 10/100Mbps Ethernet interface

  • One TF card slot

  • One 20-pin standard JTAG debug interface

  • Two input and two output I/O interfaces implemented with phoenix connectors and isolated by optocouplers

  • One SPIFI interface

  • One high-precision RTC (no battery by default)

  • Spare interface for external hardware watchdog


  • 4.3-inch (480x272) TFT LCD, 16bit RGB565 mode, supporting 4-wire resistive touch-screen

  • One ISP button

  • One buzzer

  • Electrical Features

  • Operating Temperature: 0 ℃ ~ 70 ℃

  • Storage Temperature: -40 ℃ ~ 85 ℃

  • Operating Humidity: 0% ~ 90% (Non-condensing)

  • Power Supply: DC 9~24V, 150~400mA@12V

  • Electrical Standards: CE, FCC and CCC

  • PCB Layers: 4-layer PCB

On-Board Interfaces:


On-board interfaces

System Block Diagram:


System block diagram

Table 1 Legend of Block Diagram

MINI1857 PROCESSOR CARD Interface modules of CPU
MINI1857 PROCESSOR CARD Chips or spare solder pads on the board
MINI1857 PROCESSOR CARD Interfaces on the board

Hardware Dimensions (mm):


Hardware dimensions

System Features:

  • Supporting uC/OS-II_v2.91 operating system

  • Supporting emWin5.18 graphic interface

  • Supporting FatFs_vR0.08afilesystem

  • Supporting LWIP _v1.4.0 protocol stack

Development Environments:

  • IAR EWARM Integrated Development Environment

    • All the drivers can work with IAR EWARM V6.40 or higher;

  • Keil MDK-ARM Integrated Development Environment

    • All the drivers and applications can work with Keil MDK-ARM V4.60 or higher.

Debugging Tools:

  • ULINK2

    • ULINK2 is recommended to be used under Keil MDK-ARM for best debugging performance;

  • JLINK-V9.1

    • JLINK-V9.1 is recommended to be used under IAR EWARM for best debugging performance

Drivers and Example Applications:

  • Basic peripheral driver examples;

  • BSP example applications based on uC/OS-II_v2.91 real-time operating system

  • BSP example applications based on emWin5.18 (GUI)

  • Example applications of OV9655 Camera implemented through SGPIO

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